HPE ProLiant DL365 Gen11 Supported AMD EPYC Processors

The HPE ProLiant DL365 Gen11 is a 1U, one- or two-processor server that uses 4th Generation AMD EPYC processors. This reference lists every processor option kit named in the supplied HPE QuickSpecs, with the listed base clock, core count, processor wattage and HPE part number. Processor compatibility depends on the chosen chassis, heatsinks, fans and storage configuration. Source: QuickSpecs pages 4–5 and 18–24.

Processor sockets and platform capabilities

The DL365 Gen11 supports up to two processors. Each installed processor provides 12 DDR5 memory channels and 12 DIMM slots; both processors are needed to use all 24 DIMM slots. The QuickSpecs lists up to 3TB of memory per processor, with a 6TB two-processor maximum at 1 DIMM per channel. With two sockets, the document states support for 160 PCIe 5.0 lanes and a three-link xGMI processor interconnect. Source: pages 5 and 18.

The motherboard drawing below identifies the two processor heatsinks and their relationship to the DIMM banks and fan cage.

Understanding AMD EPYC processor model numbers

HPE includes a diagram explaining the AMD EPYC 9004-series naming convention. The illustration distinguishes processor series, core-count encoding, performance designation and generation. Source: page 4.

Supported processor option kits

The tables below reproduce the exact QuickSpecs processor option-kit names and part numbers. The core, clock and wattage columns are transcribed from those HPE names, not from third-party processor specifications. HPE calls the listed wattage the default configurable thermal design power (cTDP) on page 5. All 19 models are drawn from the processor option list on pages 19–20.

Single-processor and dual-processor configuration

• A CTO server requires one processor option kit as the initial processor selection; a second processor, when selected, must use the identical -B21 processor model. Mixing different models is explicitly prohibited (page 19).
• Processor kits do not include a heatsink or fan kit. Those components are selected separately (page 19).
• A second processor enables the other 12 DIMM sockets. An EDSFF CTO configuration requires two processors (page 18).
• The document describes a maximum of 160 PCIe 5.0 lanes with two processors and three xGMI links between processors (page 5).

Thermal requirements by processor wattage

Processor wattage is only one factor in cooling eligibility. Drive count, NVMe backplanes, chassis type and DLC options can require performance cooling even with lower-wattage processors. Source: pages 4, 20, 23–24.

Drive capacity effects of higher-TDP processors

• 8SFF CTO without DLC: when processor wattage is 320W or higher, the QuickSpecs limits the configuration to eight drives per server (page 20).
• EDSFF CTO: with processors at 320W or higher, page 20 limits the server to 12 EDSFF drives unless DLC is selected. Page 24 additionally requires DLC at that wattage.
• The actual permissible layout must also satisfy backplane, drive type, chassis and thermal configuration rules; the full drive selection is documented in the storage categories.

Processor heatsinks and direct liquid cooling components

These components are referenced here because they directly determine which processor configurations can be built. They belong primarily to the separate Fans & Cooling category and are intentionally excluded from the processor-only part-number download. Official product descriptions follow page 23.

Cooling kits and installation dependencies

• Do not mix standard and performance heatsinks in the same system (page 23).
• A DLC configuration requires two processors, a secondary low-profile module and one appropriate quick-disconnect tube set (page 24).
• The PCIe DLC variant occupies PCIe slot 2 and lowers the stated PCIe card limit from two to one (page 24).
• The 55cm DLC tube set is for 8SFF/EDSFF CTO configurations; the 450mm tube set is for GPU CTO configurations (page 24).
• One-socket systems use five fans and two-socket systems use seven; the selected fan model is dictated by the thermal configuration (page 24).

Preconfigured servers and processor identification

Pages 15–16 describe factory-configured DL365 Gen11 systems with AMD EPYC 9124 or EPYC 9224 processors. Those complete-server SKUs identify a configured system, not a processor option kit; they are therefore not included in the processor product table or processor part-number file. The listed preconfigured processor wattages differ from the 200W descriptions in the option-kit list (pages 15 and 19).

QuickSpecs discrepancies and verification notes

• The overview on pages 1 and 3 advertises up to 96 processor cores, but the processor list includes 112-core EPYC 9734 (P60465-B21) and 128-core EPYC 9754 (P60463-B21). Preserve the listed kits, but confirm current HPE platform support for a planned deployment.
• The preconfigured-model table on page 15 shows EPYC 9124 and 9224 at 240W, whereas the processor option kits on page 19 describe both as 200W. The option-kit product names above have not been altered.
• Page 4 says standard fans can be used with cTDP at or below 240W. Pages 20 and 23 apply stricter less-than-240W wording; page 24 contains a less-than-or-equal-to-240W cooling summary. Verify borderline configurations.
• The QuickSpecs is Worldwide Version 12 dated October 2, 2023 (page 42); this reference records that document, not a newer certified configuration matrix.

Installation and purchasing checks

Before ordering a processor kit, confirm whether the build is single- or dual-socket, check the processor option part number exactly, and match the heatsinks and fan quantities to the selected chassis, drives and any DLC accessories. For factory-integrated orders, HPE recommends a valid configuration through an approved configurator (pages 17 and 23).